Text of Senate Amendment 6303

On 2026-06-24, Senator Jon Husted (R-OH) delivered a floor speech titled "Text Of Senate Amendment 6303" in the Senate.

Text of Senate Amendment 6303

Congressional Record, Volume 172 Issue 106 (Wednesday, June 24, 2026) [Congressional Record Volume 172, Number 106 (Wednesday, June 24, 2026)] [Senate] [Pages S3441-S3443] From the Congressional Record Online through the Government Publishing Office [ www.gpo.gov ] SA 6303. Mr. HUSTED submitted an amendment intended to be proposed by him to the bill S. 4784, to authorize appropriations for fiscal year 2027 for military activities of the Department of Defense, for military construction, and for defense activities of the Department of Energy, to prescribe military personnel strengths for such fiscal year, and for other purposes; which was ordered to lie on the table; as follows: At the end of subtitle D of title XII, add the following: SEC. 1252. REPORT ON ARTIFICIAL INTELLIGENCE POWER OF THE PEOPLE'S REPUBLIC OF CHINA. (a) In General.--Not later than 180 days after the date of the enactment of this Act, and annually thereafter for 3 years, the Secretaries, in consultation with the covered agency heads, shall submit to the Committee on Foreign Relations, the Committee on Banking, Housing, and Urban Affairs, and the Select Committee on Intelligence of the Senate and the Committee on Foreign Affairs and the Permanent Select Committee on Intelligence of the House of Representatives a report on the advanced artificial intelligence capabilities of the PRC, including the efforts by the PRC relating to supply chains for advanced artificial intelligence systems. (b) Components.--Each report required under subsection (a) shall also include the following: (1) An assessment of integrated circuits designed or optimized for advanced artificial intelligence training or inference by leading artificial intelligence chip designers in the PRC, including Huawei Technologies Co., Ltd. and Cambricon Technologies, that includes-- (A) with respect to such integrated circuits, the-- (i) total processing power; (ii) integer and floating point operations per second at relevant precision levels; (iii) memory capacity and bandwidth; (iv) interconnect bandwidth; (v) power efficiency; (vi) transistor count and die size; (vii) process node used per design; (viii) energy efficiency; (ix) manufacturing cost and yield assumptions; (x) ability of the integrated circuit to effectively run artificial intelligence models trained on a different chip designer's integrated circuit, including measurements such as model inference in tokens per second and cost per token with and without a software application layer that improves model translation ability; (xi) the capability of the most advanced server configuration produced using the chip designer's integrated circuits including such technical specifications like floating point operations per second, memory capacity and bandwidth, energy efficiency, and ability to function at scale; and (xii) any future specification that becomes relevant to the development of future artificial intelligence capability; and (B) with respect to such chip designers-- (i) the total number and types of integrated circuits produced in the year preceding submission of such report and the projected production number for the year proceeding submission of such report; (ii) the foundries used in the production of the integrated circuits; (iii) the software ecosystem, including any parallel computing platforms, programming models, or development frameworks that enable accelerated computing for artificial intelligence training or inference; (iv) the method and extent to which such integrated circuits are used in other countries, including in the United States; and (v) the manufacturer's ability to produce a software application layer required to achieve an improved token per seconds and cost per token rate. (2) An assessment of leading semiconductor fabrication facilities in the PRC that produce logic integrated circuits for use in advanced artificial intelligence training or inference, including such facilities owned or operated by the Semiconductor Manufacturing International Corporation, that includes, with respect to such facilities, the-- (A) total monthly production capacity per advanced process node with non-planar transistors or 16/14 nm and below and the percentage of that monthly production capacity dedicated to production of logic integrated circuits for use in advanced artificial training or inference; (B) yield for producing such logic integrated circuits for use in advanced artificial intelligence training or inference at each facility with an assessment of that yield in industry relevant terms, such as compared to PRC firms, compared to non-PRC firms, or how many are in current industry-leading datacenters; (C) most advanced process node under production; (D) types and volume of semiconductor manufacturing equipment used, the country of origin for such equipment, and the export control regulatory regime under which such equipment was procured; (E) collaborations, licit or illicit, between PRC firms or their subsidiaries and non-PRC firms and the advancements those collaborations produce for the PRC firm; (F) progress PRC firms are making at indigenizing export controlled technologies; (G) market share PRC firms have in the PRC and internationally; and (H) year-over-year trends in leading semiconductor fabrication facilities during at least the preceding 5-year period; (3) An assessment of leading semiconductor fabrication facilities in the PRC that produce memory integrated circuits used for advanced artificial intelligence training or inference, including such facilities owned or operated by ChangXin Memory Technologies or Yangtze Memory Technologies Corp., that includes-- (A) with respect to such circuits, the-- (i) most advanced generation of high-bandwidth memory, including the technical specifications and stack height; (ii) memory cell area and memory density of other dynamic random access memory integrated circuits; and (iii) highest number of layers in three-dimensional NOT-AND memory integrated circuits; (B) with respect to such facilities, the-- (i) yield and total monthly production capacity for memory integrated circuits, including dynamic random access memory such as high-bandwidth memory, and NOT-AND memory; and (ii) types and volume of semiconductor manufacturing equipment used, including the country of origin of such equipment and the export control regulatory regime such equipment was procured under. (C) collaborations, licit or illicit, between PRC firms or their subsidiaries and non-PRC firms and the advancements those collaborations produce for the PRC firm; (D) progress PRC firms are making at indigenizing export controlled technologies; (E) market share PRC firms have in the PRC and internationally; and (F) year-over-year trends in the PRC's advanced memory integrated circuit production for a minimum of the 5 previous years. (4) An assessment of leading semiconductor manufacturing equipment companies in the PRC, including NAURA Technology Group, KINGSEMI, Advanced Micro-Fabrication Equipment Inc., Shanghai Micro Electronics Equipment, and Shenzhen SiCarrier Technologies Co., Ltd, that includes-- (A) a categorical breakdown of annual unit production volume and technical specifications, including minimum feature size, throughput, and defect rate, of all major equipment classes installed or under development for wafer production in foundries in the PRC, including-- (i) lithography tools, including photolithography, nanoimprint, and electron beam lithography tools; (ii) etch equipment, including wet etching and dry etching; (iii) deposition equipment, including chemical vapor deposition, physical vapor deposition, and atomic layer deposition; (iv) cleaning systems; (v) chemical mechanical planarization tools; (vi) ion implantation and diffusion systems; (vii) wafer inspection, metrology, and process control tools; (viii) back-end packaging equipment, including wafer dicing equipment and wire bonders; (ix) capabilities and advancements in advanced packaging technologies; (x) thermal processing equipment; (xi) bonding equipment, including thermo compression bonders and hybrid bonders; (xii) environmental control systems; (xiii) laser systems; and (xiv) reticle and photomask writing and inspection tools; (B) the country of origin and supplier company for each piece of semiconductor manufacturing equipment used in foundries in the PRC for advanced-node logic or high- bandwidth memory production by such companies; (C) the foreign-sourced subcomponents integrated into the semiconductor manufacturing equipment produced by such companies, including precision motion stages, lasers, electrostatic chucks, optical systems, radio frequency generators, or extreme-purity gas handling systems; (D) collaborations, licit or illicit, between PRC firms or their subsidiaries and non-PRC firms and the advancements those collaborations produce for the PRC firm; (E) progress PRC firms are making at indigenizing export controlled technologies; (F) market share PRC firms have in the PRC and internationally; and (G) year-over-year trends in leading semiconductor manufacturing equipment companies in the PRC for a minimum of the 5 previous years. (5) An assessment of electronic design automation (EDA) software used in the design of integrated circuits for advanced artificial intelligence applications in the PRC, including software developed or provided by leading PRC EDA companies such as Empyrean Technology Co., Ltd. and Primarius Technologies Co., Ltd., that includes-- (A) with respect to such software tools, the-- (i) range of design stages supported, including front-end design such as architecture and register-transfer level design, logic synthesis, verification, physical design, place-and-route, timing closure, and final signoff; [[Page S3442]] (ii) compatibility with advanced process nodes, including sub-7 nanometer technologies, gate-all-around devices, and three-dimensional integration; (iii) capabilities for designing ar